3D NAND Flash, El Capitan and Peacocks’ Tails – An Outlook for 2015
2014: That was a year that was! Many of you, perhaps remembering my outlook missive from last year, must be looking forward to how I would explain my piffle given the marvelous developments over the...
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Xilinx Ultrascale+: 3D on Steroids
Ever since 3D transistors (aka FinFETS or Intel’s Tri Gate) 3D NAND, and monolithic 3D IC processes joined the family of 3D integration technology possibilities, we’ve been careful to define them...
View Article3D InCites Turns Six and Hits Over 1000 Posts
Today, LinkedIN reminded me that 3D InCites just celebrated its 6th anniversary. I also noticed that Paul Werbaneth’s latest 3D+ post, Japan, Abenomics, IoT, and the MEMS Engineer Forum 2015, was the...
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We Few, We Happy Few – Eli Harari and the Golden Thread to System Flash
An epiphany struck me last week when I attended the Flash Memory Summit in Santa Clara, California. I had come specifically to attend “A Conversation with Eli Harari” which turned out to be an...
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3D NAND at the 2015 Flash Memory Summit – Slipping the Surly Bonds of Earth?
It’s been many years since I realized that semiconductor conferences were not purely scientific but had a certain mix of marketing razzmatazz. Well, the 3D NAND razzmatazz was in full swing last week...
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With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these months. Not this year! It was a lively August, if you consider the recent...
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BeSang Inc. announces 3D super-NAND flash memory
BeSang Inc., a pioneer in the monolithic 3-dimensional integrated circuits (3D ICs), announced today its proprietary 3D super-NAND development. “We are pleased to announce 3D super-NAND, which is...
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Can 3D Super-NAND Improve Cost-per-Bit for 3D NAND?
The 3D NAND floodgates just opened a little wider with today’s announcement from BeSang that it has developed 3D Super-NAND technology, based on a monolithic 3D IC process, True 3D™ IC, claiming to be...
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The Commercialization of 3D Stackable Memory: Part One
The Challenges of Manufacturing 3D Stackable Memory Memory technologies vying to fulfill the increasing capacity and density requirements of the solid-state storage market two years from now will be...
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2015 Retrospective and Outlook for 2016: 3D NAND Flash One-upmanship
“On average since 1885, the yearly height record has gone up by 10 feet (3 meters) each time. Since the 1960s the pace has picked up to 16 feet.” This is not 3D NAND Flash but skyscraper heights in a...
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Will The Lifespan of CMOS Integrated Circuits End?
There is fierce competition for scaling foundry logic technologies. However, according to the 2015 International Roadmap for Semiconductors (ITRS), logic transistor scaling will stop at 10nm and it...
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EMD Performance Materials Announces Comprehensive Materials Solutions for...
EMD Performance Materials is the leading provider of semiconductor materials. Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today...
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The Fundamentals and Early History of Quantum Mechanical Tunneling
The mid-1920’s were the miracle years for quantum mechanics. The “Old Quantum Theory” originating with Niels Bohr, had reached crisis point by the end of 1924. Wave-particle duality from Einstein and...
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The Invention of Tunneling-Based Flash Memory
Part 2 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with a history lesson on the invention of tunneling-based flash memory. In 1956, William...
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The Future of Non-volatile Memory
Part 4 of the series, The Triumph of Quantum Mechanics at the Heart of Solid-State Data Storage, continues with the future of non-volatile memory. The figure above is a concept for 3D stacking of Flash...
View ArticleQ2 2019: Memory Business is Approaching the Bottom
“Combined DRAM and NAND revenue was US$25.4 billion in Q2 2019, down 5% from Q1 and down 39% year-over-year as sluggish demand and elevated inventory levels continued to plague the memory markets”,...
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ACM Research Enters Bevel Etch Market to Support Emerging Process Steps in 3D...
Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool expected to ship during third quarter of 2021 FREMONT, Calif., Aug. 05, 2021...
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Xperi Licenses Hybrid Bonding Technology to Yangtze Memory Technologies Co.,...
Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to YMTC for its 3D NAND memory products SAN JOSE, Calif. –Xperi Holding Corporation (NASDAQ: XPER) (“Xperi”) today announced that the...
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